Course Description
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.
DE Fee
Engineering Online GRAD
DE Program
MS E
SPRG 2022
Instructors
Classes Start:
January 10, 2022
Classes End:
April 25, 2022
Distance Education:
Yes
Class Type:
Lecture
Credits:
3.00
Delivery Method:
Internet
Restrictions:
Enrollment for this course is through the Engineering Online Registration System. Go to http://go.ncsu.edu/eol_registration
