Course Description
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.
DE Fee
Engineering Online GRAD
DE Program
MS E
SPRG 2020
Classes Start:
January 6, 2020
Classes End:
April 23, 2020
Distance Education:
Yes
Class Type:
Lecture
Credits:
3.00
Delivery Method:
Internet
Restrictions:
ONLY distance-track students with grad standing in CN, CE, EE, or EPSE may register. All other students must request enrollment through the EOL Registration System (http://go.ncsu.edu/eol_registration).