ECE 544
Design Of Electronic Packaging and Interconnects
Section: 651

Course Description

A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.

DE Fee

Engineering Online GRAD

DE Program

MS E

SUM1 10W 2019

Instructors

Classes Start:
May 15, 2019
Classes End:
July 26, 2019
Distance Education:
Yes
Class Type:
Lecture
Credits:
3.00
Delivery Method:
Internet
Restrictions:
Prerequisite: ECE 302 ONLY distance-track students with grad standing in CN, CE, EE, or EPSE may register. All other students must request enrollment through the EOL Registration System (http://go.ncsu.edu/eol_registration).

Tools