ECE 544 Design Of Electronic Packaging and Interconnects Section: 601
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.
Engineering Online GRAD
- Classes Start:January 7, 2019
- Classes End:April 26, 2019
- Distance Education: Yes
- Class Type: Lecture
- Credits: 3.00
- Delivery Method: Internet
- Restrictions: ONLY distance-track students with grad standing in CN, CE, EE, or EPSE may register. All other students must request enrollment through the EOL Registration System (http://go.ncsu.edu/eol_registration).
Dr Robert J Evans