Course Description
Processes used in fabrication of modern integrated circuits. Process steps for crystal growth, oxidation, diffusion, ion implantation, lithography, chemical vapor deposition, etching, metallization, layout and packaging. Process integration for MOS and biopolar processes. Characterization techniques, simulation, yield and reliability.
Fall 2025
Instructors
Meeting Patterns
Classes Start:
August 18, 2025
Classes End:
December 2, 2025
Location:
01010 Engineering Building I
Class Days:
M W
Class Start Time:
1:30pm
Class End Time:
2:45pm
Class Type:
Lecture
Credits:
3.00
Restrictions:
Prerequisite: ECE graduate students and ECE undergrads with a 3.5 or higher GPA