Course Description
A study of the design of digital and mixed signal interconnect and packaging. Topics covered include: Single chip (surface mount and through-hole) and multi-chip module packaging thecnology; packaging techology selection; thermal design; electricaldesign of printed circuit board, backplane and multi-chip module interconnect; receiver and driver selection; EMI control; CAD tools; and measurement issues.
DE Fee
Engineering Online GRAD
DE Program
MS E
Summer I 10W 2025
Instructors
Meeting Patterns
Classes Start:
May 14, 2025
Classes End:
July 25, 2025
Room Number:
[TBA]
Class Days:
[TBA]
Class Type:
Lecture
Credits:
3.00
Restrictions:
Prerequisite: ECE 302 Enrollment for this course is through the Engineering Online Registration System. Go to http://go.ncsu.edu/eol_registration
