ECE 533

Power Electronics Design & Packaging

Section: 001

Course Description

This course introduces design of high-performance power electronic circuits where the integrated physical topology must be considered as part of the circuit, and provides an understanding of the multitude of parasitic elements created by circuit layout, materials and fabrication techniques. This prepares the student for high-density, high-frequency design of converters, gate drive circuits and resonant topologies. The student is also introduced to a power-electronics packaging lab and primary fabrication processes, such as Direct Bonded Copper (DBC) module construction with heavy-wire bonding, two-sided and 3D power modules in layered polymers, and high-voltage isolation of circuits with encapsulate in modules.