Course Description
Ion implantation and doping for advanced semiconductor devices, thin films and epitaxy, silicides, ohmic contacts and interconnection metallurgy, oxidation and nitridation, gettering of impurities and dopant segregation phenomena, electromigration, electronic packaging materials science and advanced device concepts.
Fall 2024
Instructors
Meeting Patterns
Classes Start:
August 19, 2024
Classes End:
December 3, 2024
Location:
02220 Engineering Building 3
Class Days:
M W
Class Start Time:
3:00pm
Class End Time:
4:15pm
Class Type:
Lecture
Credits:
3.00
Restrictions:
None
